Deep Collaboration with Industry Leaders Accelerates Innovation in Cloud Data Centers

SAN JOSE, Calif., March 14, 2019 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced its commitment to open computing at the 2019 Open Compute Project (OCP) Global Summit being held March 14 – 15 at the San Jose Convention Center. A long-time supporter of open, standards-based technology, Broadcom is committed to developing high performance, scalable solutions optimized for today’s hyperscale data centers. Broadcom is a leading provider of OCP-compliant solutions, either directly through design project contributions or indirectly, via ODM and OEM integrations; in fact, roughly seven out of ten OCP networking hardware and storage contributions incorporate Broadcom technologies.

Broadcom’s technologies are specifically designed to deliver maximum performance and bandwidth while providing energy and cost efficiencies and Broadcom switches, network adapters and storage connectivity solutions are featured in a broad range of OCP architectures and designs. Notable OCP projects involving Broadcom’s technologies include:

• A collaborative project with Facebook to build a community for hardware-accelerated infrastructure in areas such as video delivery
• A collaboration with Microsoft to enable the OCP community with RTL models for data compression acceleration

• Facebook’s 128x100 GbE Minipack platform built on Broadcom’s Tomahawk® 3 Ethernet Switch

• A collaborative industry project for developing the third generation OCP NIC standard (OCP NIC 3.0) to enhance server networking I/O bandwidth with expanded provisions for thermal footprints.

“Broadcom is proud to be a leader in this vibrant OCP community through the delivery of industry-first networking, storage and compute solutions that support high-performance cloud data centers,” said Charlie Kawwas, Ph.D., Senior Vice President and Chief Sales Officer at Broadcom. “As IT technology continues to evolve toward a cloud-based, application-driven ecosystem, the introduction of new innovations, such as the industry’s first 12.8Tbps switch, OCP NIC 3.0 and end-to-end PCIe Gen 4 solutions, will benefit the cloud ecosystem and, ultimately, end users.”