CSPs improve call processing performance 30% with latest release of Oracle Communications Session Border Controller
Feb 26, 2018
New innovations in reliability, performance and serviceability drive next-generation of industry’s leading SBC platform and Acme Packet 6350
Redwood Shores, Calif.—Feb 26, 2018
Delivering new innovations in one of the world’s most widely deployed SBC offering, Oracle today announced the next generation of Oracle Communications Session Border Controller (SBC) and Acme Packet Platform . With these enhancements, Communications Service Providers (CSPs) can benefit from new industry-leading VoLTE subscriber density, and significantly improved call-processing performance, while achieving new levels of security and reliability, with a reduced hardware footprint and lower costs.
“CSPs are in the midst of a massive digital transformation. But while they move to diversify revenue streams and explore adjacent markets, it’s critical that they maintain stellar performance across their core services,” said Doug Suriano, group vice president, Oracle Communications. “These recent enhancements underscore our commitment to helping our CSP customers innovate, while also protecting their network core with the industry’s top performing, most cost-effective and reliable SBC solutions.”
Oracle Communications SBCs enables trusted, first-class communications across IP network access borders and IP interconnect borders, including fixed line, mobile (VoLTE), and over-the-top (OTT) services. Based on Acme Packet OS, Oracle Communications SBC operates on Oracle's range of purpose-built hardware platforms or general-purpose servers to deliver a unique combination of performance, capacity, high availability, and manageability. With the offering, CSPs can manage critical requirements for security, interoperability, reliability and quality, regulatory compliance, and revenue/cost optimization.
Industry Leading Performance and Serviceability
Whether it’s standard voice calls, video conferencing, instant messaging, or OTT, Oracle Communications SBC is the backbone for delivering trusted communications. With the new innovations in Oracle Communications SBC release S-Cz8.0.0, CSPs can enhance call-processing performance by up to 30 percent—delivering an even better experience to their customers.
The new offering now runs as a single software image that supports both Acme Packet platforms as well as virtualized deployments, enabling easier, seamless adoption of virtualization. New serviceability features also enable CSPs to quickly self-diagnose network and/or system issues, increasing network reliability and shortening time-to-repair. Finally, release S-Cz8.0.0 contains many enhancements increasing network border security, and dramatically increases the capacity of virtualized deployments.
Acme Packet 6350—The Leading Platform for VoLTE Deployments
Oracle introduces the latest and highest performing addition to the Acme Packet platform family, the Acme Packet 6350. Already deployed in production networks of leading carriers today, the Acme Packet 6350 is a compact 3U platform that increases subscriber density threefold, while also reducing CSPs hardware footprint and enabling reduced costs. This makes the platform especially relevant for VoLTE access deployments, where Oracle is an industry leader in VoLTE subscriber density under real-world conditions.
Additional benefits and features of the Acme Packet 6350 include:
- 8 Core CPU for even greater processing power
- 48 GB system memory providing added performance and incredible subscriber density
- High-density transcoding
- Field proven architecture, with a high capacity in a small (3RU) footprint
- Leverages many Acme Packet 6300 components, including the NIU, TCU, and SSM3
Oracle Communications provides the integrated communications and cloud solutions that enable users to accelerate their digital transformation journey—from customer experience to digital business to network evolution. See Oracle Communications SBC in action at Mobile World Congress, Barcelona, February 26–March 1, 2018, Hall 3, Booth 3B30.
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