Today at HotInterconnects 2015, Intel provided new details for its future Intel® Omni-Path Architecture (Intel® OPA), a next-generation high performance computing (HPC)-optimized fabric technology and a key component of Intel's HPC scalable system framework. Intel OPA is designed for the integration of fabric components with CPU and memory to reduce latency, increase node bandwidth and enable the lower power, higher density systems required by next-generation data centers. The additional details on OPA were included in a technical paper that will be presented today at 2:10 p.m. by Todd Rimmer, Intel OPA software architect.
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