Huawei and ESI Sign a MoU to innovate HPC for industrial manufacturing acceleration

Via Huawei Corporate News

Sep 6, 2016

[Shanghai, China, September 6, 2016] Huawei signed a Memorandum of Understanding (MoU) with Paris-based ESI Group (ESI) at HUAWEI CONNECT 2016 in Shanghai recently. The two parties will collaborate on High-Performance Computing (HPC) and cloud computing to provide innovative industrial manufacturing solutions for customers worldwide. They also jointly released a white paper on the Huawei HPC platform-based Virtual Performance Solution (VPS), which has its origins in PAM-CRASH, ESI’s software package used for crash simulations.

ESI and Huawei representatives at the ceremony

ESI’s virtual reality solution enables the Huawei HPC platform to provide customers with digital equipment room layouts that are of the same proportion to those of the physical environments they replicate. Leveraging virtual reality technology, designers can keep improving virtual prototypes during product R&D to reduce the need for physical prototypes, which results in a dramatic reduction in design costs and shorter product development cycles.

The MoU signed by the two parties includes multiple cooperation plans. One is to build a joint innovation center in Munich, Germany to enable the two parties to verify and innovate cloud computing and HPC solutions based on ESI’s industrial simulation test applications and Huawei’s leading IT productions and platforms. Another is to build a global experience center in Hangzhou, China that will allow customers to experience the latest products and service training sessions.

The two parties also agreed to initiate a series of cooperation projects worldwide to jointly promote and deliver innovative cloud computing and HPC product R&D and simulation solutions. All these cooperative efforts will provide global customers with innovative R&D technologies to help them address challenges brought by the exponential growth of technology in the future.

Zheng Yelai, President, Huawei IT Product Line, addresses the ceremony audience

Commenting at the MoU signing ceremony, Zheng Yelai, President, Huawei IT Product Line, said, “The ongoing digital transformation of industrial manufacturing demands enterprise-level IT solutions that are more intelligent, efficient, and convenient, especially in the HPC domain. Upholding the core values of openness, cooperation, and win-win, Huawei consolidates the resources and capabilities of all its industrial partners to provide more powerful industrial manufacturing solutions for customers to help them succeed.”

Christopher St. John speaks at the ceremony

Christopher St. John, ESI Chief Operating Officer, said, “ESI is very pleased to reach this comprehensive MoU on industrial cloud computing and HPC simulation technology with Huawei, our partner in global technology cooperation and technology innovation. In the last two years, Huawei and ESI have furthered their cooperation in the European market and achieved remarkable results. Huawei is one of ESI’s most important global partners, and future collaboration between the two parties is very promising because both share the same understanding of industrial manufacturing markets and possess extraordinary innovation capabilities.”

HUAWEI CONNECT 2016 was held from August 31-September 2 in Shanghai at the Shanghai Expo Centre, Mercedes-Benz Arena, and Shanghai World Expo Exhibition and Convention Center (SWEECC). It was attended by over 20,000 industry leaders who discussed how to build a Better Connected World, and how to promote digital transformation in industries.

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